Mobile PCB with BGA Min. line space: 0.15mm Min. line width: 0.15mm Thickness: 1.0mm Board technology: immersion gold Blind and buried via[...]

Material: FR-4 Layer: 6layer Board thickness: 1.6mm Surface finish: ENIG Solder Mask type: Green Min line space and width: 3 mil Min hole size: 0.1mm the other surface finish we can do are: ENIG,HAL Lead free, Emmersion silver, Gold plating, silver plating, OSP, the other solder mask type: green, yellow, white ,black, purple[...]

Material: FR-4 Layer: 10 layer Board thickness: 1.6mm Surface finish: HAL lead free Solder Mask type: Green Min line space and width: 3 mil Min hole size: 0.1mm the other surface finish we can do are: ENIG,HAL Lead free, Emmersion silver, Gold plating, silver plating,OSP, the other solder mask type: green, yellow, white ,black, purple[...]